1. CLC 16-320

    High strength. A two part, five minute epoxy with high strength for quick repair applications. CLC 16-320

  2. CLC 16-600

    RT Cure, 5 Minute adhesive. Clear when cured, good for quick repairs. CLC 16-600

  3. CLP 7106 / CLI 4010

    Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010

  4. CLR 1066 / CLH 6520

    Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

  5. CLR 1066 / CLH 6930

    Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930

  6. CLR 1180 / CLH 6020

    A low viscosity, two component, unfilled, room temperature cure, epoxy system. This system provides resiliency and strength making it suitable for a variety of applications. ie. adhesives, castings, coatings and tooling. CLR 1180 / CLH 6020

  7. CLR 1180 / CLH 6560

    Room temp cure, Excellent shock resistance. An exceptional epoxy casting system with excellent thermal and mechanical shock resistance. CLR 1180 / CLH 6560

  8. CLR 1180 / CLH 6930

    Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930

  9. CLR 1183 / CLH 6560

    Shock resistant, General purpose epoxy. A two component epoxy casting system. product has low shrinkage and excellent shock resistance. CLR 1183 / CLH 6560

  10. CLR 1190 / CLH 6025

    General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025

  11. CLR 1190 / CLH 6560

    Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

  12. CLR 1190 / CLH 6830

    5 min. gel general purpose adhesive. A two component, five minute epoxy system with optical clarity and high strength for quick repair applications. CLR 1190 / CLH 6830

  13. CLR 1220 / CLH 6858

    5 min. gel general purpose adhesive. A two component, five minute epoxy system with optical clarity and high strength for quick repair applications. CLR 1220 / CLH 6858

  14. CLR 1396 / CLH 6930

    Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930

  15. CLR 1625 / CLH 6330

    General Purpose Epoxy. An unfilled, room temperature cure, clear laminating system. Its low viscosity gives the system excellent wet -out properties to fibreglass and other reinforcing fibres. The material will also saturate wood readily. For a faster system use hardener CLH 6333. CLR 1625 / CLH 6330

  16. CLR 1625 / CLH 6333

    General Purpose Epoxy. An unfilled, room temperature cure, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material will also saturate wood readily. CLR 1625 / CLH 6333

  17. CLR 1796 / CLH 6580

    UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

  18. XPD 1401 / CLI 4182

    Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182

  19. XR 52092 / XH 62093

    1:1 machine dispense adhesive. Adhesive for bonding synthetic aggregates to metal. A medium viscosity, room temperature curing, two component epoxy adhesive. Product was developed with improved thin film set time when bonding metal substrates. XR 52092 / XH 62093

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